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  6. Signing and Packaging Web Services 1.0.0 Release Review

Eclipse Common Build Infrastructure Signing and Packaging Web Services 1.0.0 Release Review

Type: 
Release
Graduation
State: 
Pending
End Date of the Review Period: 

Reviews run for a minimum of one week. The outcome of the review is decided on this date. This is the last day to make comments or ask questions about this review.

Wednesday, May 17, 2017
Project: 
Eclipse Common Build Infrastructure
Release: 

Signing and Packaging Web Services 1.0.0

Description: 

This is the initial release of signing and packaging web services implementation. It delivers the following features:

  • Jar signing
  • Windows executable signing
  • macOS .app bundles signing
  • macOS .dmg packaging and signing

 

API Certification: 

The project leadership certifies that the APIs in this release are "Eclipse Quality".

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Incubating - Eclipse Common Build Infrastructure

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  • Eclipse Technology
    • Eclipse Tycho™

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  • Eclipse Technology
  • Eclipse Common Build Infrastructure

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